The IEEE International Electron Devices Meeting took place in San Francisco in December 2000 and the talk was all about the single-electron transistor-the SET. Currently, successful implementations of SETs have only been at low temperatures, but that is changing. There was a lot of conversation about nudging the operational temperatures for SETs toward those more closely associated with normal, day-to-day human life. That the physics behind these devices is compelling is clear. How to get from theory to mass-produced products of use to the consuming public is not so clear.

Lots of sci-fi has come out of the IEDM and other cutting-edge IEEE conferences over the years.

Systems on a chip and IP reuse started off at the conceptual, sci-fi level-the stuff of Ph.D. theses-and have become, through hard work and persistence, the emerging and mainstream technologies of today. But, how do we know which concepts warrant this level of effort, or which merely constitute a cul-de-sac of innovation and design? Sometimes the answer is clear. At other times, it isn't. However, keeping an eye on a wide range of developments is always time well spent. Especially for the curious at heart.

Printed Circuit Design-our sister publication-is preparing for the PCB West show in Santa Clara in mid-March. For the first time this year, ISD Magazine is spearheading the IP/SOC conference, co-located with PCB West. The two shows are an excellent opportunity for people working in either discipline-chip or board design-to cross the Great Divide by traversing the steps between the two exhibit halls. Are you interested in the business of IP reuse, the technical complexities behind the integration of multiple functions onto a single chip, the latest in PLDs, MCMs, high-density interconnects, flex, chip-scale, or BGA packages-or the CAD tools that facilitate all of this and more? Lucky you. You must be someone who continues to be interested in all aspects of electronic system development and design.

Sometimes we hear rumors that chip designers and board designers live in different worlds, that they are less-than-willing to learn about the other side of the Great Divide. How can that be? How can people who were curious enough to want to learn math, physics, chemistry, thermodynamics, materials, metallurgy, wave or system theory, not continue to enjoy a fundamental curiosity about their physical world? How can they not want to wander over to the other side-or exhibit hall-and learn something new?

Perhaps people are believing that printed circuit boards are evolving right out of our lives. Nothing could be further from the truth. There are more circuit boards being produced this year than ever before, and they're faster, sleeker, smaller (for cell phones), larger (for the Network infrastructure), and incresingly more elegantly conceived and designed. It's a great time to be in PCB design.

Meanwhile, system chips are coming on-line in conjunction with 0.13-micron-and smaller-process technologies, the 300-mm wafer, 6-to-8 metal layers, ferociously increasing Internet bandwidth and demand, remotely collaborating teams, hierarchical and platform-based design methodologies, growing commoditization of IP, increasing awareness of design-for-test and robust verification strategies, and a whole host of marvelously intersecting technologies that are revolutionizing the entire semiconductor industry. It's a great time to be in IC design.

Want to cross the Great Divide? Come to IP/SOC and PCB West in March 2001-find out how easy it is to take a walk on the wild side.